The official banner for the IEEE Conference on Virtual Reality + User Interfaces, comprised of a Kiwi wearing a VR headset overlaid on an image of Mount Cook and a braided river.

IEEE Virtual Reality International Program Committee

Supercommittee

  • Bruder, Gerd - University of Central Florida
  • Steinicke, Frank - Universität Hamburg
  • Argelaguet Sanz, Ferran - Inria
  • Interrante, Victoria - University of Minnesota
  • Froehlich, Bernd - Bauhaus-Universität Weimar
  • McMahan, Ryan P. - University of Central Florida
  • Figueroa, Pablo - Universidad de los Andes
  • Marchal, Maud - Univ. Rennes, INSA, IRISA, Inria
  • Billinghurst, Mark - University of South Australia
  • Sadagic, Amela - Naval Postgraduate School (NPS)

Committee

  • Bruder, Gerd - University of Central Florida
  • Steinicke, Frank - Universität Hamburg, Germany
  • Argelaguet Sanz, Ferran - Inria
  • Interrante, Victoria - University of Minnesota
  • Froehlich, Bernd - Bauhaus‐Universität Weimar, Germany
  • McMahan, Ryan P. - University of Central Florida, USA
  • Figueroa, Pablo - Universidad de los Andes
  • Marchal, Maud - Univ. Rennes, INSA, IRISA, Inria
  • Billinghurst, Mark - University of South Australia, Australia
  • Sadagic, Amela - Naval Postgraduate School (NPS), USA
  • Andersen, Daniel - Facebook Reality Labs
  • Liu, Shiguang - Tianjin University
  • Zhou, Qian - Autodesk Research
  • Isogawa, Mariko - NTT
  • Stefanucci, Jeanine - University of Utah
  • Jeon, Seokhee - Kyung Hee University
  • Iwai, Daisuke - Osaka University
  • Itoh, Yuta - The University of Tokyo
  • Ortega, Francisco - Colorado State University
  • Zalake, Mohan - University of Florida
  • Chowdhury, Tanvir Irfan - Marshall University
  • Pan, Ye - Shanghai Jiaotong University
  • Zhang, Guofeng - Computer Science College
  • Chen, Hsiang-Ting - University of Adelaide
  • Su, Simon - National Institute of Standards and Technology
  • Cho, Isaac - Utah State University
  • Islam, Rifatul - University of Texas at San Antonio
  • Piumsomboon, Thammathip - University of Canterbury, New Zealand
  • Liu, Yue - Beijin Institute of Technology
  • Kiyokawa, Kiyoshi - Nara Institute of Science and Technolo-gy, Japan
  • Kim, Gerard - Korea University
  • Watanabe, Yoshihiro - Tokyo Institute of Technology
  • Walsh, James A. - University of South Australia
  • Grubert, Jens - Croburg University, Germany
  • Hodgson, Eric - Miami University
  • Ferrise, Francesco - Politecnico di Milano
  • Grimm, Paul - Darmstadt University of Applied Science
  • Azimi, Ehsan - John Hopkins University, United States
  • Duval, Thierry - IMT Atlantique
  • Dodiya, Janki - IU Internationale Hochschule
  • Rodriguez-Conde, Ivan - University of Arkansas at Little Rock
  • Wu, Hongzhi - Zhejiang University
  • Weissker, Tim - Unlisted Unlisted
  • Roth, Daniel - Human-Centered Computing and Extended Reality, Germany
  • Si-Mohammed, Hakim - University of Lille
  • Zielasko, Daniel - University of Trier
  • Saint-Aubert, Justine - Inria Bretagne-Atlantique
  • Howard, Thomas - CNRS
  • Peng, Yifan (Evan) - Stanford University
  • Jankowski, Jacek - Intel
  • Tatzgern, Markus - Salzburg University of Applied Science
  • Pietrzak, Thomas - University of Lille
  • Mori, Shohei - Graz University of Technology
  • Besançon, Lonni - Monash University
  • Williams, Ian - Birmingham City University, UK
  • Weyers, Benjamin - Trier University
  • Andujar, Carlos - Universitat Poltecnica de Catalunya, Spain
  • Podkosova, Iana - TU Wien
  • Prouzeau, Arnaud - Inria
  • Galvan Debarba, Henrique - Aalborg University
  • Serrano, Ana - University of Zaragoza
  • Langbehn, Eike - University of Applied Sciences Ham-burg
  • Serrano, Marcos - IRIT - Elipse
  • Peillard, Etienne - Lab-STICC
  • Simeone, Adalberto - KU Leuven
  • Plopski, Alexander - University of Otago
  • Nilsson, Niels Christian - Aalborg University Copenhagen
  • Akşit, Kaan - University College London
  • Seichter, Hartmut - University of Applied Sciences Schmalkalden
  • Batmaz, Anil Ufuk - Concordia University
  • Walczak, Krzysztof - Poznań University of Economics and Business
  • Maciel, Anderson - Federal University of Rio Grande do Sul
  • Narumi, Takuji - The University of Tokyo
  • Olivier, Anne-Hélène - University of Rennes 2
  • Dal Sasso Freitas, Carla - Federal University of Rio Grande do Sul
  • Jung, Sungchul - Kennesaw State University
  • de Jesus Oliveira, Victor Adriel - St. Poelten University of Applied Sci-ences
  • Gao, Yang - Beihang university
  • Buck, Lauren - Vanderbilt University
  • Yang, Yalong - Virginia Tech
  • Desai, Kevin - The University of Texas at San Antonio
  • Carnell, Stephanie - University of Central Florida
  • Thomas Jr., Jerald - Virgina Tech
  • Ebrahimi, Elham - UNC Wilmington
  • Robb, Andrew - Clemson University
  • Merritt, Timothy - Aalborg University
  • Ammi, Mehdi - University of Paris 8
  • Kuroda, Yoshihiro - University of Tsukuba
  • Wang, Miao - Beihang University
  • Chellali, Amine - Univ Evry,Université Paris Saclay
  • Lok, Benjamin - University of Florida
  • Lin, Wen-Chieh - National Yang Ming Chiao Tung Uni-versity
  • Banic, Amy - University of Wyoming
  • Munsinger Ph.D., Brita - Trinity University
  • Hoermann, Simon - University of Canterbury
  • Kim, Kangsoo - University of Calgary
  • Shao, Tianjia - Zhejiang University
  • Lukosch, Heide - University of Canterbury
  • Bouzbib, Elodie - Inria, Université de Rennes, CNRS, IRISA
  • Normand, Jean-Marie - Ecole Centrale de Nantes
  • Schmalstieg, Dieter - Graz University of Technology
  • Costa de Souza, Vinicius - Institute of Informatics, Federal Universi-ty of Rio Grande do Sul (UFRGS)
  • Jackson, Bret - Macalester College
  • Nguyen, Huyen - Université Paris-Saclay, CNRS, LISN
  • Roberts, David - Shared Realities Ltd
  • Fuhrmann, Arnulph - TH Köln
  • Peng, Chao - Rochester Institute of Technology
  • Suma Rosenberg, Evan - University of Minnesota
  • Johnsen, Kyle - University of Georgia
  • Adcock, Matt - CSIRO
  • Kán, Peter - Aarhus University
  • Sun, Qi - New York University
  • Ens, Barrett - Monash University
  • Cunningham, Andrew - University of South Australia
  • Kuhl, Scott - Michigan Technological University
  • Kelly, Jonathan - Iowa State University
  • Rojas-Mu??oz, Edgar - Texas A&M University
  • Mania, Katerina - Technical University of Crete
  • Krösl, Katharina - VRVis Forschungs-GmbH
  • Boulic, Ronan - EPFL
  • Nedel, Luciana - Federal University of Rio Grande do Sul (UFRGS)
  • Nunes, Fatima - University of São Paulo
  • Binaee, Kamran - Department of Psychology
  • Serafin, Stefania - Aalborg University
  • Gomes de Siqueira, Alexandre - Florida University
  • Wang, Dangxiao - Beihang University
  • McNamara, Ann - Texas A&M University
  • Guo, Rongkai - Kennesaw State University
  • Shahnewaz Ferdous, Sharif Mohammad - The College of New Jersey
  • Broll, Wolfgang - Ilmenau University of Technology
  • Lin, Ming - University of Maryland at College Park
  • Clark, Adrian - University of Canterbury
  • Stuerzlinger, Wolfgang - Simon Fraser University
  • Reyserhove, Hans - Meta
  • Bera, Aniket - Purdue University
  • Banerjee, Sean - Clarkson University
  • Banerjee, Natasha - Clarkson University
  • Li, Sheng - Peking University
  • Zhu, Yuhao - University of Rochester
  • Zhou, Bin - Beihang University
  • Kalkofen, Denis - Flinders University
  • Bozgeyikli, Lila - University of Arizona
  • Lindeman, Robert - University of Canterbury
  • Servières, Myriam - Centrale Nantes
  • Ferstl, Ylva - Ubisoft
  • Swan II, J. Edward - Mississippi State University
  • Masia, Belen - Universidad de Zaragoza
  • Takashima, Kazuki - Tohoku University
  • Thomas, Bruce - University of South Australia
  • Gracanin, Denis - Virginia Tech
  • Babu, Sabarish V. - Clemson University
  • McDonnell, Rachel - Trinity College Dublin

Conference Sponsors

Special

Lujiazui Logo

Diamond

Platinum

Baidu Logo

Gold

Senstime Logo
Unity china
XImmerse Logo
Vivo Logo

Silver

GritWorld logo

Bronze

ImageDerivative logo
yuanjing alibaba logo
raysengine alibaba logo
S-Dream logo
VRIH logo
VRIH logo
evis logo
kanjing logo
lianying logo

Doctoral Consortium Sponsors

Supporters

Tencent Learn logo
lenovo logo
qualcomm logo
liangfengtai logo
hgmt logo

Host

SJTU

Co-Host

ZJU NUIST

Supporting Associations

ccf-vr Logo CSIG-VR Logo cgs-vcc Logo
CCF-VR CSIG-VR CGS-VCC
cvrvt Logo mia Logo siga Logo
CVRVT MIA SIGA
cvrvt Logo
SJMC


Code of Conduct

© IEEE VR Conference 2023, Sponsored by the IEEE Computer Society and the Visualization and Graphics Technical Committee