2019 IEEE VR Osaka logo

March 23rd - 27th

2019 IEEE VR Osaka logo

March 23rd - 27th

IEEE Computer Society IEEE VRSJ

IEEE Computer Society IEEE VRSJ


The Telecommunications Advancement Foundation

Tateishi Science and Technology Foundation


IEEE Kansai Section

Society for Information Display Japan Chapter

VR Consortium

The Institute of Systems, Control and Information Engineers

Human Interface Society

The Japanese Society for Artificial Intelligence

The Visualization Society of Japan

Information Processing Society of Japan

The Robotics Society of Japan

Japan Society for Graphic Science

The Japan Society of Mechanical Engineers

Japanese Society for Medical and Biological Engineering

The Institute of Image Information and Television Engineers

The Society of Instrument and Control Engineers

The Institute of Electronics, Information and Communication Engineers

The Institute of Electrical Engineers of Japan

The Society for Art and Science

Japan Ergonomics Society

The Japanese Society of Medical Imaging

Exhibitors and Supporters

Exhibitors and Supporters

IEEE VR 2019: the 26th IEEE Conference on Virtual Reality and 3D User Interfaces
March 23-27, 2019, Osaka, Japan

Important Dates

  • February 1st, 2019: Deadline for application and full payment
  • February 22nd, 2019: Space assignment mailed to exhibitors
  • February 8th, 2019: No refunds for cancellations


IEEE VR provides a unique opportunity for your organization to reach the world’s foremost VR researchers and application builders. We invite companies, government organizations, and academic institutions to showcase VR-related products – hardware, software, integrated systems, peripherals, innovations, literature, or anything else of interest to our conference participants. Regular refreshments and a special reception will be offered in the exhibit hall, ensuring a good audience for exhibitors. Additional sponsorship and marketing opportunities are available in the Exhibitor Prospectus, which has detailed information on pricing,schedule, and terms.


For more information, please contact the exhibits chairs at exhibitschairs2019 [at] ieeevr.org

  • Hisayo Yoshida, Hexagon Japan, Japan
  • Jerome Perret, Haption GmbH, Germany
  • Sin-Hwa Kang, University of Southern California, USA
  • Ichiro Imamura, Solidray, Japan

exhibitschairs2019 [at] ieeevr.org